Scholarship Details

Level of Study:	Undergraduate Programme
Application Timeline:	Present - 31 May 2024
Scholarship Eligibility:	- Eligible for Year 2-4 Bachelor's Degree student only  - Eligible for Malaysia citizen only - CGPA requirement: minimum 3.2000 - Priority for student with Huawei certificate HCIA/HCIP/HCIE - Priority for student who selected for Huawei Seeds program and training program - Sponsored students is required to work for Huawei for a minimum period of 2 years from the service commencement    date, failing which the Sponsored Student is liable to reimburse the Sponsor the entire amount of the Sponsored Fees.
Scholarship Coverage :	RM10,000 per annum

For more details: Please download the poster or application form.