Level of Study:

Undergraduate Programme

Application Timeline:   

26 January 2026 - 27 February 2026

Scholarship Eligibility:   

- Eligible for Year 2-4 Bachelor's Degree student only 

- Eligible for Malaysia citizen only

- CGPA requirement: minimum 3.2000

- Priority for student with Huawei certificate HCIA/HCIP/HCIE

- Priority for student who selected for Huawei Seeds program and training program

- Sponsored students is required to work for Huawei for a minimum period of 2 years from the service commencement
   date, failing which the Sponsored Student is liable to reimburse the Sponsor the entire amount of the Sponsored Fees.

Scholarship Coverage :  

RM10,000 per annum