UNIVERSITI TUNKU ABDUL RAHMAN

IOI Foundation, formerly known as Yayasan Tan Sri Lee Shin Cheng, was established in 1985 under the patronage of the IOI Group. The Foundation serves as a platform for the Group to compliment its corporate social responsibility via educational, medical and community initiatives that enrich the lives of the less fortune. 


IOI Foundation dedicates itself to the advancement of human capital by providing scholarships and financial assistance to underprivileged students. The foundation supports initiatives that enhance student’s capabilities as potential leaders who can work equally with their brains and their hearts.




Scholarship Details

Level of Study:

Undergraduate Programme

Application Timeline:   

1 April 2024 - 30 June 2024

Scholarship Eligibility:   

- Obtained the following minimum pre-university results: 

  • STPM/A-Level - minimum 2As
  • Unified Examination of Chinese Schools (UEC-SM3) 
  • Foundation - CGPA of minimum 3.50
  • Australian TER - minimum 90.0
  • First/Second year undergraduates must have a current CGPA of at least 3.30, Upper Second-Class Honours or
         equivalent.

- Posses outstanding co-curricular achievements and leadership qualities. 

- Willing to serve an employment bond with IOI Group for a specified period upon successful completion of studies

- Must not be receiving any form of scholarships from other organisations and be free of any future employment
  obligations

- Open to students who are currently pursuing Bachelor's Degree in local university (public/private/foreign branch
   campus), with priority given to the following programmes: 

  • Accountancy/Finance/Data Science/Risk Management
  • Agriculture
  • Engineering (Mechanical/Chemical/Electrical/Electronic/Instrumentation)
  • Food Science/Food Technology/Chemistry
 - Those currently pursing Foundation  studies and Pre-Degree Programmes are not eligible to apply

Scholarship Coverage :   

Scholarship recipients will be required to serve the IOI Group upon graduation at various locations in Malaysia. The bond period will depend on the amount of the scholarship.


For more details and application: Please visit the official website and download poster.